Redundant power for processor circuit board

A method, comprising:

• providing a first circuit board having plural separate processors;
• connecting plural separate redundant power systems and a single thermal dissipation device to the first circuit board to form a multi-processor module;
• connecting the multi-processor module to a second circuit board, such that a space is created between the first and second circuit boards;
• and
• thermally dissipating heat away from both the plural processors and the plural power systems with the single thermal dissipation device.

An apparatus, comprising:

• first and second printed circuit boards (PCBs) coupled in a vertically stacked relationship to create a space therebetween and having plural heat-generating components requiring assistance with heat dissipation;
• at least two redundant power systems coupled to at least one of the first and second PCBs, wherein each power system serves as a duplicate for preventing failure upon failure of one of the power systems;
• and
• a thermal dissipation device for dissipating heat, via an airflow, away from the two power systems and for dissipating heat, via heat exchange, away from the plural heat-generating components.