Alloy type thermal fuse and material for a thermal fuse element
AssigneeUchihashi Estec Co., Ltd.
InventorYoshiaki Tanaka
Life of this patent
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Abstract
An alloy type thermal fuse is provided in which a Bi—Sn alloy is used as a fuse element, which has an operating temperature of about 140° C., which, even when used at a high power, can safely operate, and in which dispersion of the operating temperature can be sufficiently reduced. Also a material for a thermal fuse element is provided. An alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn is used as a fuse element of the alloy type thermal fuse.
Claims16
An alloy type thermal fuse containing a thermal fuse element comprising an alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn, wherein said fuse element is connected between lead conductors, and at least a portion of each of said lead conductors which is bonded to said fuse element is covered with a Sn or Ag film.
An alloy type thermal fuse containing a thermal fuse element comprising an alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn, wherein lead conductors are bonded to ends of said fuse element, respectively, a flux is applied to said fuse element, said flux-applied fuse element is passed through a cylindrical case, gaps between ends of said cylindrical case and said lead conductors are sealingly closed, ends of said lead conductors have a disk-like shape, and ends of said fuse element are bonded to front faces of said disks.
An alloy type thermal fuse containing a thermal fuse element comprising an alloy composition in which Bi is larger than 50% and 56% or smaller, and a balance is Sn, wherein a pair of film electrodes are formed on a substrate by printing conductive paste containing metal particles and a binder, said fuse element is connected between said film electrodes, and said metal particles are made of a material selected from the group consisting of Ag, Ag—Pd, Ag—Pt, Au, Ni, and Cu.
Dependencies are inferred from the claim text.