High-frequency module and its manufacturing method

A high-frequency module device comprising:

• a base board having a high-frequency filter element layer forming surface formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board;
• and
• a high-frequency element part having a passive element and a circuit element for receiving power or a signal supplied from said base board via a dielectric insulating part made of a dielectric insulating material, on the high-frequency filter element layer forming surface of said base board;
• wherein a distributed constant circuit is disposed between layers of said base board, wherein said ground part is formed above and below said distributed constant circuit.

A high-frequency module device comprising:

• a base board having a high-frequency filter element layer forming surface formed by performing flattening processing on an uppermost layer of a multilayer printed wiring part in which a printed wiring layer having a ground part and a dielectric insulating layer made of a dielectric insulating material are formed in a multilayer form on one major surface of a core board;
• and
• a high-frequency element part having a passive element and a circuit element for receiving power or a signal supplied from said base board via a dielectric insulating part made of a dielectric insulating material, on the high-frequency filter element layer forming surface of said base board;
• wherein a distributed constant circuit is disposed between layers of said base board, wherein said distributed constant circuit is an antenna circuit part formed by a depositing technique.