Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure
AssigneeVIA Technologies, Inc.
InventorJimmy Hsu
Life of this patent
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AssigneeVIA Technologies, Inc.
InventorJimmy Hsu
Estimating the term…
A signal transmission structure is provided. The structure comprises a reference plane, a bonding pad, a conductive trace and a conductive ball. By changing the shapes of the reference plane and the conductive trace, the equivalent capacitance at the conductive ball and the signal route near the conductive ball is reduced, or the equivalent inductance at the conductive ball and the signal route near the conductive ball is increased to compensate the high equivalent capacitance between the conductive ball and the reference plane. Therefore, the impedance of the conductive ball and the signal route near the conductive ball are matched to increase the integrity of the signals after these signals pass through the conductive ball and the signal neighbor route near the conductive ball.
A signal transmission structure, comprising:
A signal transmission structure, comprising:
A signal transmission structure, comprising:
Dependencies are inferred from the claim text.