Transmission line structures
AssigneeBookham Technology PLC
InventorRoyston Powell
Life of this patent
Estimating the term…
Abstract
A composite waveguide termination structure including two different waveguide conductor geometries operatively located upon a common substrate, wherein each such waveguide geometry includes a ground conductor on the same surface of the substrate.
Claims10
A composite waveguide termination structure, comprising at least two waveguide conductors having different geometries operatively located upon a common substrate, wherein each said waveguide conductor geometry includes a ground conductor on the same surface of the substrate, the ground conductors being electrically connected to each other, wherein a first of said geometries forms a microstrip transmission line and the second of said geometries forms a modified co-planar transmission line in which the ground conductor thereof is located on an opposite surface of the substrate to a conductor electrode thereof, and wherein the microstrip transmission line is arranged to feed into the co-planar transmission line.
A composite waveguide termination structure, comprising
- a first microstrip transmission line section including a substrate interposed between a first conductor electrode and a first ground conductor,
- a second modified co-planar transmission line section including a substrate that is an extension of the substrate of the first section,
- a second conductor electrode, and
- a second ground conductor,
- wherein the second ground conductor is provided on an opposite surface of the substrate relative to the second conductor electrode, and the second ground conductor is provided on the same surface of the substrate as the first ground conductor and is electrically connected therewith, and wherein the microstrip transmission line is arranged to feed into the co-planar transmission line.
A composite waveguide termination structure, comprising a microstrip transmission line that is arranged to feed into a modified co-planar transmission line having the same substrate as that of the microstrip transmission line, such that a ground conductor of each said microstrip and co-planar transmission lines are connected directly to a packaging base for the transmission lines, wherein the modified co-planar transmission line geometry is such that the ground conductor thereof is located on an opposite surface of the substrate to a conductor electrode thereof, and the ground conductor of both lines are provided on the same surface of the substrate and electrically connected to each other.
Dependencies are inferred from the claim text.