Interposer probe and method for testing
AssigneeAgilent Technologies, Inc.
InventorsDonald Earl Schott, Brent Anthony Holcombe, Peter Joseph Martinez
Life of this patent
Estimating the term…
Abstract
An interposer probe includes a main board having a first side and a second side. A lower riser board mounted to the first side of the main board and in electrical contact therewith is configured to engage an integrated circuit socket on a device to be tested. An upper riser board mounted to the second side of said main board and in electrical contact therewith, is configured to receive an integrated circuit package. A retention frame mounted to the first side of said main board engages the integrated circuit socket on the device to be tested.
Claims20
An interposer probe, comprising:
- a main board having a first side and a second side;
- a lower riser board mounted to the first side of said main board and in electrical contact therewith, said lower riser board being configured to engage an integrated circuit socket on a device to be tested;
- an upper riser board mounted to the second side of said main board and in electrical contact therewith, said upper riser board being configured to receive an integrated circuit package;
- and
- a retention frame mounted to the first side of said main board, said retention frame engaging the integrated circuit socket on the device to be tested.
An interposer probe, comprising:
- a main board having a first side and a second side;
- a lower riser board having a first side and a second side, the first side of said lower riser board being mounted to the first side of said main board, so that said lower riser board is electrically connected to said main board, the second side of said lower riser board being adapted to be received by an integrated circuit socket on a device to be tested so that the integrated circuit socket on the device to be tested is electrically connected to said main board via said lower riser board;
- an upper riser board having a first side and a second side, the first side of said upper riser board being mounted to the second side of said main board so that said upper riser board is electrically connected to said main board;
- an integrated circuit socket mounted to the second side of said upper riser board so that the integrated circuit socket is electrically connected to the main board via the upper riser board, said integrated circuit socket being adapted to receive an integrated circuit package;
- and
- a retention frame mounted to the first side of said main board, said retention frame engaging the integrated circuit socket on the device to be tested, said retention frame holding the second side of said lower riser board in electrical contact with the integrated circuit socket on the device to be tested.
A method for testing a device having at least one integrated circuit socket, comprising:
- providing an interposer probe having a first side and a second side, the first side of said interposer probe having a lower riser board and a retention frame mounted thereto, the lower riser board being configured to be received by the integrated circuit socket on the device, the second side of said interposer probe having an upper riser board mounted thereto, the upper riser board being configured to receive an integrated circuit socket thereon configured to receive an integrated circuit package;
- engaging the lower riser board of the interposer probe and the integrated circuit socket on the device with the retention frame;
- engaging the integrated circuit package with the integrated circuit socket on the interposer probe;
- and
- using the interposer probe to probe at least one electrical signal between the integrated circuit package and the device.
Dependencies are inferred from the claim text.