US 7,064,566 B2 · Probe card assembly and kit

Abstract

In a probe card assembly, a series of probe elements can be arrayed on a silicon space transformer. The silicon space transformer can be fabricated with an array of primary contacts in a very tight pitch, comparable to the pitch of a semiconductor device. One preferred primary contact is a resilient spring contact. Conductive elements in the space transformer are routed to second contacts at a more relaxed pitch. In one preferred embodiment, the second contacts are suitable for directly attaching a ribbon cable, which in turn can be connected to provide selective connection to each primary contact. The silicon space transformer is mounted in a fixture that provides for resilient connection to a wafer or device to be tested. This fixture can be adjusted to planarize the primary contacts with the plane of a support probe card board.

Claims14

Dependent claims

An apparatus for providing external equipment with signal access to bond pads of an integrated circuit implemented on a wafer, wherein the wafer is formed substantially of a semiconductor material having a first coefficient of thermal expansion, the apparatus comprising:

a probe board;
a semiconductor substrate having a planar surface;
a plurality of conductive probes mounted on the planar surface of the semiconductor substrate for contacting the bond pads;
and
first means for providing signal paths between the probe board and the plurality of conductive probes,
wherein each of the plurality of conductive probes comprises a resilient, conductive, spring contact.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

09/042,606Filed 16 Mar 1998 · continuation in part

Priority

16 Nov 1993

Published

US 2001/0054905 A127 Dec 2001

Granted

20 Jun 2006

Term ends

Not estimatedThe source records don’t support an estimate.

Classification65 codes

H05K 3/4015
Surface contacts, e.g. bumps: using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
B23K 1/0016
Specially adapted for particular articles or work: soldering of electronic components
B23K 20/004
Specially adapted for particular articles or work: wire welding
G01R 1/07342
With individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or…:…

Family

Application08/152,812Parent of this continuation-in-part · filed 16 Nov 1993

Application08/340,144Parent of this continuation-in-part · filed 15 Nov 1994

PCT/US94/13373Parent of this continuation-in-part · filed 16 Nov 1994

Application08/452,255Parent of this continuation-in-part · filed 26 May 1995

Application08/554,902Parent of this continuation-in-part · filed 9 Nov 1995

PCT/US95/14844Parent of this continuation-in-part · filed 13 Nov 1995

PCT/US95/14909Parent of this continuation-in-part · filed 13 Nov 1995

Application60/040,983Us provisional application · filed 17 Mar 1997

US 2001/0054905 A1Pre-grant publication · published 27 Dec 2001

US 5,974,662 AParent of this continuation-in-part

US 6,336,269 B1Parent of this continuation-in-part

US 5,917,707 AParent of this continuation-in-part

US 5,476,211 AParent of this continuation-in-part

US 7,064,566 B2This patent

From the US filing history. Foreign family members aren’t listed.

Probe card assembly and kit

Life of this patent

Probe card assembly and kit

Life of this patent

Abstract

Claims14