Method and structure for measuring a bonding resistance

A structure for measuring a bonding resistance between a first object and a second object, wherein said first object has a plurality of first pins and a reference pin device, said second object has a plurality of second pins corresponding to said plurality of first pins and said reference pin device, and said pins and said reference pin device adjacent to each other are mutually insulated, comprising:

• a first circuit formed by electrically connecting said reference pin device to said respective first pin adjacent to said reference pin in a first direction;
• and
• a second circuit formed by electrically connecting a first said respective second pin corresponding to said reference pin device to a second said respective second pin adjacent to said first said respective second pin in a second direction, wherein said second direction is opposite to said first direction.