US 7,064,449 B2 · Bonding pad and chip structure

Abstract

A chip structure and a bonding pad are provided. The chip structure comprises a chip and at least a bonding pad. The chip has an active surface. The bonding pad is disposed on the active surface of the chip. The bonding pad comprises a polygonal body and a plurality of first protruding portions. The polygonal body has a first planar surface and a corresponding second planar surface. The second planar surface of the polygonal body is in contact with the chip. The first protruding portions are disposed on the first planar surface at the corner regions of the polygonal body. By modifying the geometric shape of the bonding pad, the yield of bonding the chip structure and another device together through the bonding pad is increased.

Claims17

Dependent claims

A bonding pad for disposing on a chip, comprising:

a body having a first surface and a corresponding second surface and having a central region and corner regions, wherein the body is disposed on the chip, and the second surface of the body is in contact with the chip;
a plurality of first protruding portions disposed on the first surface at the corner regions of the body;
and
a second protruding portion disposed on the first surface in the central region of the body, wherein each of the first protruding portions extends to the central region from the corner region to connect to the second protruding portion.

1 more element

Dependencies are inferred from the claim text.

Bonding pad and chip structure

Life of this patent

Bonding pad and chip structure

Life of this patent

Abstract

Claims17