Multi-chip ball grid array package
AssigneeSamsung Electronics Co., Ltd.
InventorsJong-Joo Lee, Dong-Ho Lee
Life of this patent
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Abstract
A multi-chip BGA package has two or more rerouted chips, each of which has one or more electrode plates. The electrode plate is coplanar with rerouting lines on the rerouted chip and may act as a decoupling capacitor, reducing simultaneous switching noise from fluctuations in power voltage, without causing an increase in thickness of the package. Further, each pair of rerouting lines on upper and lower rerouted chips includes two or more interconnection bumps. This reduces inductance and resistance of electric signal propagation. Therefore, the multi-chip BGA package of this invention can realize small, thin, high-speed and high-density memory devices.
Claims34
A multi-chip package comprising:
- a first semiconductor chip coupled with a first electrode plate;
- a second semiconductor chip coupled with a second electrode plate, the first electrode plate and the second electrode plate arranged to provide a decoupling capacitor between the first semiconductor chip and the second semiconductor chip;
- and
- first rerouting lines coupled with the first semiconductor chip, wherein the first semiconductor chip, first electrode plate, and the first rerouting lines constitute part of a first rerouted chip.
A multi-chip package comprising:
- a first rerouted chip including a first semiconductor chip with first chip pads, and first rerouting lines on the first semiconductor chip to electrically connect with the first chip pads, each first rerouting line having a first bump pad, a third bump pad, and a bond pad;
- a second rerouted chip facing the first rerouted chip including a second semiconductor chip having second chip pads, and second rerouting lines disposed on the second semiconductor chip to electrically connect with the second chip pads, each second rerouting line having a second bump pad and a fourth bump pad;
- a plurality of first interconnection bumps between and electrically connecting the first bump pad and the second bump pad;
- a plurality of second interconnection bumps between and electrically connecting the third bump pad and the fourth bump pad;
- a substrate fixedly supporting the first rerouted chip;
- a plurality of bonding wires disposed on the respective bond pads to electrically connect the first rerouting lines with the substrate;
- and
- a plurality of conductive balls under the substrate to electrically connect the substrate to electronics.
Dependencies are inferred from the claim text.