Integrated electrical circuit and method for fabricating it

A method for fabricating an integrated electrical circuit, which comprises:

• forming a plurality of structure planes including at least one element structure plane;
• forming electrically active elements on the at least one element structure plane;
• applying a first insulation layer above the at least one element structure plane, the first insulation layer having first contact holes disposed therein, and the first contact holes being filled with a metal;
• applying a second insulation layer above the first insulation layer, the second insulation layer having second contact holes disposed therein and filled with electrical connecting leads, and the second contact holes being further filled with copper in a whole-area manner;
• applying connection pieces underneath the electrical connecting leads and above the first contact holes;
• applying at least one diffusion blocker underneath the electrical connecting leads, the diffusion blocker at least one of impeding and preventing a diffusion of copper, the diffusion blocker configured as a blocker layer interrupted only in a region having the first contact holes formed therein, the blocker layer disposed between the first insulation layer and the second insulation layer;
• and
• wherein the connection pieces are made of aluminum and cover the first contact holes and contact the connection leads, and the connection pieces are covered by the second insulation layer.