Customized microelectronic device and method for making customized electrical interconnections
AssigneeAtmel Corporation
InventorsKen M. Lam, Walter C. Bell
Life of this patent
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Abstract
A method and apparatus electrically coupling input/output bond pads that are disposed proximate to one another on a microelectronic device. The apparatus includes a microelectronic device having at least two conductive input/output bond pads electrically coupled to an integrated circuit of the microelectronic device and first and second conductive stud balls bonded to first and second input/output pads, respectively, and a third conductive stud ball bonded to the first and second conductive stud balls. A wire bonding tool in “stud ball” mode is utilized to bond the conductive stud balls.
Claims27
A microelectronic device comprising:
- an integrated circuit device having first and second conductive bond pads disposed on a surface of said integrated circuit device, said first conductive bond pad being spaced apart from and proximate to said second conductive bond pad, said first and second conductive bond pads being both in electrical connection with said integrated circuit device;
- and
- a first conductive stud ball bonded to said first conductive bond pad, a second conductive stud ball bonded to said second conductive bond pad, and a third conductive stud ball bonded to said first and second conductive stud balls, said third conductive stud ball electrically connecting said first and second conductive bond pads.
A method of forming an electrical connection between first and second proximate conductive bond pads disposed on and electrically coupled to an integrated circuit device having circuits, comprising:
- bonding a first conductive stud ball to said first conductive bond pad;
- bonding a second conductive stud ball to said second conductive bond pad;
- and
- electrically connecting said first and second conductive bond pads by bonding a third conductive stud ball to said first and second conductive stud balls.
A microelectronic device assembly comprising:
- a microelectronic device having a first circuit structure, a first conductive bonding pad electrically coupled to the first circuit structure, a second circuit structure, and a second conductive bonding pad electrically coupled to the second circuit structure;
- a first conductive stud ball bonded to said first conductive bonding pad;
- a second conductive stud ball bonded to said second conductive bonding pad;
- a third conductive stud ball bonded to said first and second conductive stud balls;
- and
- a substrate electrically connected to said microelectronic device.
Dependencies are inferred from the claim text.