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US 7,064,433 B2Granted
Multiple-ball wire bonds
AssigneeAsm Technology Singapore Pte Ltd
InventorsYam Mo Wong, Jin Siong Joshua Soh
Life of this patent
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Abstract
The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on the connection pad that is contiguous with the first bump ball.
Claims12
A method of forming a wire bond bonding a wire to a connection pad of an electronic device comprising the steps of:
- forming a first bump ball on the connection pad;
- edging the first bump ball and forming a recessed portion in the bump ball;
- and then
- forming a second bump ball on the connection pad that is contiguous with the first bump ball.
1 more element
A method of forming a wire bond bonding a wire to a connection pad of an electronic device comprising the steps of:
- forming a first bump ball on the connection pad;
- forming a second bump ball on the connection pad that is contiguous with the first bump ball;
- edging the first and/or second bump ball and forming a recessed portion in the first and/or second bump ball;
- and then
- forming an additional bump ball that is contiguous with the first and/or second bump ball.
2 more elements
Dependencies are inferred from the claim text.