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US 7,064,430 B2Granted
Stacked die packaging and fabrication method
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Ming Ying, Il Kwon Shim, Roger Emigh
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.
Claims16
A method of manufacturing a semiconductor package comprising:
- providing a substrate;
- attaching a crenellated spacer to the substrate wherein the crenellated spacer comprises:
- a base;
- a number of merlons on the base;
- and
- a number of embrasures intermediate adjacent ones of the number of merlons;
- attaching at least one top die to at least some of the number of merlons;
- wire bonding the at least one top die to the substrate;
- and
- forming an encapsulant over the crenellated spacer and the at last one top die.
7 more elements
A method of manufacturing a semiconductor package comprising:
- providing a substrate;
- attaching at least one of a lower die, an active component, a passive component, and combinations thereof to the substrate;
- wire bonding the at least one lower die to the substrate;
- attaching a crenellated spacer to the substrate at least partially around the at least one lower die wherein the crenellated spacer comprises;
- a base;
- a number of merlons on the base;
- a number of embrasures intermediate adjacent ones of the number of merlons;
- attaching at least one top die to at least some of the number of merlons;
- wire bonding the at least one top die to the substrate;
- and
- forming an encapsulant over the at least one lower die, the crenellated spacer, and the at least one top die.
8 more elements
A semiconductor package comprising:
- a substrate;
- a crenellated spacer attached to the substrate wherein the crenellated spacer comprises:
- a base;
- a number of merlons on the base;
- a number of embrasures intermediate adjacent ones of the number of merlons;
- at least one top die attached to at least some of the number of merlons;
- wires bonding the at least one top die to the substrate;
- and
- an encapsulant over the crenellated spacer and the at least one top die.
6 more elements
A semiconductor package comprising:
- a substrate;
- at least one of a lower die, an active component, a passive component, and combinations thereof attached to the substrate;
- a first number of wires bonding the at least one lower die to the substrate;
- a crenellated spacer attached to the substrate at least partially around the at least one lower die wherein the crenellated spacer comprises:
- a base;
- a number of merlons on the base;
- a number of embrasures intermediate adjacent ones of the number of merlons;
- at least one top die attached to at least some of the number of merlons;
- a second number of wires bonding the at least one top die to the substrate;
- and
- an encapsulant over the at least one lower die, the crenellated spacer, and the at least one top die.
8 more elements
Dependencies are inferred from the claim text.