Optical surface mount technology package
OwnerRobert E. Wilsoninventor
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a package substrate, an optical device die atop the package substrate, a transparent optical element atop the die, an optional dam around the die, and an encapsulant entirely covering the die and partially covering the transparent optical element.
Claims28
A semiconductor package comprising:
- a package substrate;
- a die atop the package substrate, the die comprising an optical device;
- a transparent optical element atop the die;
- a dam surrounding the die;
- and
- an encapsulant within the dam, wherein the encapsulant entirely covers the die and partially covers the transparent optical element.
A semiconductor package comprising:
- a package substrate;
- a die atop the package substrate, the die comprising an optical device;
- a transparent optical element atop the die;
- an encapsulant entirely covering the die and partially covering the transparent optical element;
- wherein the package substrate is selected from the group consisting of a printed circuit board and a ceramic substrate.
A semiconductor package comprising:
- a package substrate comprising a ball grid array on a bottom surface;
- a die atop the package substrate, the die comprising an optical device;
- a transparent optical element atop the die;
- and
- an encapsulant entirely covering the die and partially covering the transparent optical element.
The method of claim 13, wherein the transparent optical element is selected from the group consisting of a filter and a lens.
A method for creating a semiconductor package comprising:
- mounting a die atop a package substrate, the die comprising an optical device;
- mounting a transparent optical element atop the die;
- forming a dam around the die;
- depositing an encapsulant within the dam to entirely cover the die and to partially cover the transparent optical element.
A method for creating a semiconductor package comprising:
- mounting a die atop a package substrate, the die comprising an optical device and the package substrate being selected from the group consisting of a printed circuit board and a ceramic substrate;
- mounting a transparent optical element atop the die;
- and
- depositing an encapsulant to entirely cover the die and to partially cover the transparent optical element.
A method for creating a semiconductor package comprising:
- mounting a die atop a package substrate the die comprising an optical device and the package substrate comprising a ball grid array on a bottom surface;
- mounting a transparent optical element atop the die;
- and
- depositing an encapsulant to entirely cover the die and to partially cover the transparent optical element.
Dependencies are inferred from the claim text.