IC module and IC card

An IC module, comprising:

• an IC chip provided on one surface of a substrate;
• and
• a terminal group, including a plurality of terminals adjacent to each other, provided on a back surface of the substrate including the IC chip, one of the terminals being a ground terminal and other terminals including a plurality of external connection terminals electrically connected to the IC chip, wherein:
• the ground terminal is disposed adjacent to each of the other terminals, provided on the back surface of the surface having the IC chip, so as to have a constant gap between the ground terminal and each of the other terminals, and
• the other terminals provided on the back surface of the surface having the IC chip include curved convex faces, and the ground terminal includes curved concave faces, each of which is a counter face positioned opposite to each of the curved convex faces of the other terminals so that there is the constant gap between the curved convex face and each of the curved concave faces, and the gap between the ground terminal and each of the other terminals is narrower than a gap between all the other terminals, other than the ground terminal, provided on the back surface of the substrate including the IC chip,
• wherein a wiring pattern (A), corresponding to the ground terminal, formed on the substrate so as to be positioned on the surface having the IC chip, and a wiring pattern (B), electrically connected to the other terminals other than the ground terminal, are disposed locally close to each other, said other terminals and said ground terminal being provided on the substrate so as to be positioned on the back surface of the surface having the IC chip, and
• wherein a gap between the wiring pattern (A) and the wiring pattern (B) is narrower than each of the gap between all the other terminals other than the ground terminal that are provided on the substrate so as to be positioned on the back surface of the substrate including the IC chip.

An IC module, comprising:

• an IC chip provided on one surface of a substrate;
• and
• a terminal group, including a plurality of terminals adjacent to each other, provided on a back surface of the substrate including the IC chip, one of the terminals being a ground terminal and other terminals including a plurality of external connection terminals electrically connected to the IC chip, wherein:
• a wiring pattern (A), corresponding to the ground terminal formed on the substrate, and a wiring pattern (B), electrically connected to the other terminals other than the ground terminal, wherein the wiring pattern (A) and the wiring pattern (B), which are disposed locally close to each other, are provided in such a manner that the gap (c) between the wiring pattern (A) and the wiring pattern (B) is equal to or narrower than the gaps (a and b) between the terminals provided so as to be close to each other, said other terminals and said ground terminal being provided on the substrate so as to be positioned on the back surface of the substrate including the IC chip.

An IC module, comprising:

• an IC chip provided on one surface of a substrate;
• and
• a terminal group, including a plurality of terminals adjacent to each other, provided on a back surface of the substrate including the IC chip, one of the terminals being a ground terminal and other terminals including a plurality of external connection terminals electrically connected to the IC chip, wherein:
• a wiring pattern (A), corresponding to the ground terminal formed on the substrate so as to be positioned on the surface having the IC chip, and a wiring pattern (B), electrically connected to the other terminals other than the ground terminal, are disposed locally close to each other, said other terminals and said ground terminal being provided on the substrate so as to be positioned on the back surface of the substrate including the IC chip, wherein a gap between the wiring pattern (A) and the wiring pattern (B) is narrower than a gap between all the terminals provided on the substrate so as to be positioned on the back surface of the surface having the IC chip.