Electronic assembly with integrated IO and power contacts
AssigneeIntel Corporation
InventorDonald T. Tran
Life of this patent
Estimating the term…
Abstract
In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.
Claims26
An integrated circuit comprising:
- a base that includes power contacts which extend from an upper surface of the base to receive power from a voltage source;
- a substrate mounted to the upper surface of the base, the substrate being electrically coupled to the base, wherein the upper surface of the base includes a recess, the substrate being mounted within the recess;
- and
- a die mounted on the substrate, the die being electrically coupled to the substrate to receive power from the voltage source through the power contacts on the base.
An electronic assembly comprising:
- a base that includes power contacts which extend from an upper surface of the base;
- a substrate mounted to the upper surface of the base;
- a die mounted on the substrate;
- a motherboard positioned adjacent to a bottom surface of the base, the motherboard being electrically coupled to the base;
- and
- a daughterboard engaging the power contacts on the upper surface of the base to electrically couple a voltage source on the daughterboard to the die.
An electronic system comprising:
- a bus;
- a memory coupled to the bus;
- an electronic assembly that includes a motherboard and a daughterboard where at least one of the motherboard and the daughterboard are coupled to the bus, the electronic assembly further including a base mounted on the motherboard, a substrate mounted to an upper surface of the base and a die mounted on the substrate, the base including power contacts that extend from the upper surface of the base to engage the daughterboard;
- and
- a voltage source mounted on the daughterboard to provide power to the die through the power contacts.
An integrated circuit comprising:
- a base that includes power contacts which extend from an upper surface of the base to receive power from a voltage source, the base further including I/O contacts that extend from a bottom surface of the base, the power contacts being of a blade type and the I/O contacts being formed in a large grid array;
- a substrate mounted to the upper surface of the base, the substrate being electrically coupled to the base;
- and
- a die mounted on the substrate, the die being electrically coupled to the substrate to receive power from the voltage source through the power contacts on the base.
An integrated circuit comprising:
- a base that includes power contacts which extend from an upper surface of the base to receive power from a voltage source;
- a substrate that is surface mounted to the upper surface of the base, the substrate being electrically coupled to the base;
- and
- a die mounted on the substrate, the die being electrically coupled to the substrate to receive power from the voltage source through the power contacts on the base.
Dependencies are inferred from the claim text.