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US 7,064,421 B2Granted
Wire bonding package
AssigneeALi Corporation
InventorsYu-Ling Chiu, Chun-Ming Chen, Wei-Chou Hung
Life of this patent
Estimating the term…
Abstract
A wire bonding package has a housing having a plurality of pins, a circuit board installed inside the housing and having at least a trace connected to a pin of the housing, at least a die installed on the circuit board and having a plurality of bonding pads, and at least a bonding line connected between a bonding pad of the die and the trace of the circuit board so that the bonding pad of the die is electrically connected to the pin of the housing.
Claims9
A wire bonding package comprising:
- a housing having a plurality of pins installed;
- a circuit board installed inside the housing, the circuit board comprising at least a trace connected to the pins of the housing;
- at least a die installed on the circuit board, the die having a plurality of bonding pads installed;
- at least a first bonding line connected between the bonding pads of the die and the trace of the circuit board so that the bonding pads of the die are electrically connected to the pins of the housing;
- and
- at least one solder pad soldered to the first bonding line at a point on the first bonding line between the bonding pad of the die and the trace of the circuit board.
3 more elements
Dependencies are inferred from the claim text.