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US 7,064,420 B2Granted
Integrated circuit leadframe with ground plane
AssigneeST Assembly Test Services Ltd.
InventorsByung Joon Han, Byung Hoon Ahn, Zheng Zheng
Life of this patent
Estimating the term…
Abstract
A leadframe for a semiconductor package includes signal and ground leads, a ground plane, and a frame paddle. Supports connect the signal and ground leads, ground plane, and frame paddle in at least two different layers. At least one force release and stress relief structure is incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.
Claims20
A leadframe for a semiconductor package, comprising:
- signal and ground leads;
- a ground plane configured for direct connection to ground wires from a die;
- a frame paddle;
- supports connecting the signal and ground leads, ground plane, and frame paddle in at least two different layers;
- and
- at least one force release and stress relief structure incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein.
3 more elements
A semiconductor package, comprising:
- a leadframe having:
- signal and ground leads;
- a ground plane connected to a plurality of the pound leads;
- a frame paddle;
- supports connecting the signal and ground leads, ground plane, and frame paddle in at least three different layers;
- and
- force release and stress relief structures incorporated into the leadframe to free the ground plane substantially from distortion and warpage resulting from residual mechanical stresses therein;
- a semiconductor die located on the frame paddle;
- an adhesive securing the semiconductor die to the frame paddle;
- at least one ground wire connected between the semiconductor die and the ground plane;
- at least one signal wire connected between the semiconductor die and at least one of the signal leads;
- and
- an encapsulating body formed substantially around the leadframe, wires, and semiconductor die.
10 more elements
Dependencies are inferred from the claim text.