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AssigneeRenesas Technology Corp.
InventorsJiro Yugami, Natsuki Yokoyama, Toshiyuki Mine, Yasushi Goto
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There is provided a semiconductor device configured as follows. On a semiconductor substrate, a titanium oxide film which is an insulating film having a higher dielectric constant than that of a silicon dioxide film is formed as a gate insulating film, and a gate electrode is disposed thereon, resulting in a field effect transistor. The end portions in the gate length direction of the titanium oxide film are positioned inwardly from the respective end portions on the source side and on the drain side of the gate electrode, and the end portions of the titanium oxide film are positioned in a region in which the gate electrode overlaps with the source region and the drain region in plan configuration. This semiconductor device operates at a high speed, and is excellent in short channel characteristics and driving current. Further, in the semiconductor device, the amount of metallic elements introduced into a silicon substrate is small.
A semiconductor device having a semiconductor substrate and a field effect transistor formed on said semiconductor substrate, said field effect transistor comprising source and drain regions formed in said semiconductor substrate, a gate insulating film formed on said semiconductor substrate, and a gate electrode disposed on said gate insulating film,
Dependencies are inferred from the claim text.