Implantable device feedthrough assembly
AssigneeMedtronic, Inc.
InventorsMark T. Marshall, James R. Svensk, Kenneth E. Cobian, Richard D. Ries
Life of this patent
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Abstract
An implantable component including a feedthrough assembly and a method for forming the feedthrough assembly wherein a coating forming a fluid barrier over an insulator, an insulator-to-terminal pin interface and an insulator-to-ferrule interface is incorporated.
Claims16
An implantable component including a feedthrough assembly, the feedthrough assembly comprising:
- an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule;
- an insulator-to-ferrule interface;
- an insulator-to-terminal pin interface;
- and
- a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface,
- wherein the backfill further includes a layer of epoxy and the coating is located between the epoxy layer and the insulator.
An implantable component including a feedthrough assembly, the feedthrough assembly comprising:
- an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule;
- an insulator-to-ferrule interface;
- an insulator-to-terminal pin interface;
- and
- a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface,
- wherein the backfill further includes a layer of epoxy and the epoxy layer is located between the coating and the insulator.
An implantable component including a feedthrough assembly, the feedthrough assembly comprising:
- an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule;
- an insulator-to-ferrule interface;
- an insulator-to-terminal pin interface;
- and
- a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface,
- wherein the backfill further includes a layer of silicone and the coating is located between the silicone layer and the insulator.
An implantable component including a feedthrough assembly, the feedthrough assembly comprising:
- an insulator electrically isolating a terminal pin from a ferrule, the terminal pin extending through the ferrule interface;
- an insulator-to-ferrule;
- an insulator-to-terminal pin interface;
- and
- a backfill deposited over the insulator and including a non-conductive polymer coating forming a fluid barrier over the insulator, the insulator-to-ferrule interface and the insulator-to-terminal pin interface,
- wherein the backfill further includes a layer of silicone and the silicone layer is located between the coating and the insulator.
Dependencies are inferred from the claim text.