Process for fabricating an electrical circuit comprising a polishing step
AssigneesSTMicroelectronics S.r.l., Koninklijke Philips Electronics N.V.
InventorsSrdjan Kordic, Alain Inard, Céline Roussel, Philippe Gayet
Life of this patent
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Abstract
A process for fabricating an integrated electrical circuit comprises the formation and then the removal of conducting inserts. Components of the electrical circuit are incorporated into insulating materials superposed on top of a substrate. The process makes it possible to provide an exclusion volume around certain components sensitive to electrostatic coupling, while giving each insulating material a planar surface at the end of a polishing step.
Claims32
A process for fabricating an electrical circuit, wherein successive layer treatments are carried out on top of a substrate in order to produce at least a first component in a first portion of the circuit and second components in a second portion of the circuit adjacent to the first portion, wherein at least a first of the layer treatments comprises the following steps:
- forming, in a first electrically insulating material present on top of the substrate, compensation cavities in the first portion of the circuit and trenches corresponding to at least some of the second components in the second portion of the circuit;
- covering the first insulating material with a first conducting material so as to substantially fill the compensation cavities and the trenches formed in the first insulating material;
- polishing the first conducting material until exposing part of the first insulating material in the second portion;
- and
- removing the first conducting material in the first portion;
- and wherein at least a second of the layer treatments comprises the following steps:
- forming, in a second electrically insulating material present on top of the substrate, at least one trench corresponding to the first component in the first portion of the circuit;
- covering the second insulating material with a second conducting material so as to substantially fill the trench formed in the first portion;
- and
- partially removing the second conducting material until exposing part of the second insulating material in the first portion.
A circuit fabrication process wherein a first layer of treatments comprise the steps of:
- forming, in a first insulating material present on a substrate:
- (i) compensation cavities in a first portion of a circuit, and
- (ii) trenches corresponding to components in a second portion of said circuit;
- filling substantially said compensation cavities and said trenches with a first conducting material;
- polishing said first conducting material to expose said first insulating material in said second portion;
- and
- removing said first conducting material in said first portion;
- and
- wherein a second layer of treatments comprises the steps of:
- forming, in a second insulating material present on said substrate, a trench corresponding to a component in said first portion;
- filling substantially said trench formed in said first portion with a second conducting material;
- and
- removing partially the second conducting material until exposing part of the second insulating material.
Dependencies are inferred from the claim text.