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US 7,064,047 B2Granted
Semiconductor device having a ball grid array and a fabrication process thereof
AssigneeFujitsu Limited
InventorsNorio Fukasawa, Hirohisa Matsuki, Kenichi Nagashige, Yuzo Hamanaka, Muneharu Morioka
Life of this patent
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Abstract
A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied to such an edge part is dissipated by the chamfer surface of the stepped surface.
Claims9
A method of fabricating a semiconductor device, comprising the steps of:
- forming a resin layer on a principal surface of a semiconductor substrate;
- grooving said resin layer along a dicing line on said semiconductor substrate to form a first groove having a substantially rectangular cross-section and a first width in said resin layer;
- and dicing, after said step of grooving, said semiconductor substrate along said first groove by forming a second groove with a second width smaller than said first width of said first groove.
A method of fabricating a semiconductor device, comprising the step of:
- adhering a semiconductor substrate on a dicing apparatus by an adhesive tape;
- dicing said semiconductor substrate in a first direction such that said adhesive tape remains substantially intact;
- dicing said semiconductor substrate in a second, different direction together with said adhesive tape, to form a plurality of adhesive strips each carrying thereon a plurality of semiconductor chips aligned in a row;
- and
- applying a V-shaped saw blade having a V-shape saw edge laterally to each of said adhesive strips such that said V-shaped saw blade cuts into a gap formed between a pair of adjacent semiconductor chips by said dicing step conducted in said first direction, said saw blade thereby forming a chamfer surface on a side wall of said semiconductor chips such that said chamfer surface extends, in each of said semiconductor chips, generally perpendicularly to a principal surface of said semiconductor chip.
2 more elements
A method of fabricating a semiconductor device, comprising the steps of:
- forming a V-shaped groove on a top surface of a semiconductor substrate, said semiconductor device carrying an electronic circuit on said top surface;
- forming a resin layer on said top surface of said semiconductor substrate so as to fill said V-shaped groove;
- and
- dicing said semiconductor substrate by a dicing saw having a blade width smaller than a width of said V-shaped groove, along said V-shaped groove.
1 more element
A method of fabricating a semiconductor device, comprising the steps of:
- slicing a semiconductor substrate from a semiconductor ingot;
- applying a resin layer on a first surface of said semiconductor substrate such that said resin layer has a planarized surface;
- grinding a second surface of said semiconductor substrate while using said planarized surface of said resin layer as a reference surface, to form a planarized surface on said second surface;
- and
- grinding said first surface while using said second, planarized surface as a reference surface, to form a planarized surface on said first surface.
2 more elements
A method of fabricating a semiconductor device, comprising the steps of:
- mounting a semiconductor device having a chamfered surface and a plurality of bump electrodes on a transportation device,
- said transportation device comprising a tray member adapted to support said semiconductor device in a face-down state, said tray member having an opening for accommodating said bump electrodes when said semiconductor device is mounted on said tray member, and a removable cap member provided on said tray member removably, said removable cap member covering said tray member in a state in which said semiconductor device is mounted on said tray member, said tray member including a chamfer surface for engagement with said chamfer surface on said semiconductor device;
- and
- transporting said semiconductor device in a state mounted on said transportation device.
1 more element
A method of fabricating a semiconductor device, comprising the steps of:
- mounting a semiconductor device having a stepped surface and a plurality of bump electrodes on a transportation device,
- said transportation device comprising a tray member adapted to support said semiconductor device in a face-down state, said tray member having an opening for ccommodating said bump electrodes when said semiconductor device is mounted on said tray member, and a removable cap member provided on said tray member removably, said removable cap member covering said tray member in a state in which said semiconductor device is mounted on said tray member, said tray member including a stepped surface for engagement with said stepped surface on said semiconductor device;
- and
- transporting said semiconductor device in a state mounted on said transportation device.
1 more element
Dependencies are inferred from the claim text.