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US 7,064,028 B2Granted
Semiconductor memory and method of producing the same
AssigneeKabushiki Kaisha Toshiba
InventorsEiji Ito, Hitoshi Ito
Life of this patent
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Abstract
A semiconductor memory incorporates cylinder-type stacked capacitors. Each capacitor has a lower electrode and an upper electrode facing each other via a dielectric film. The lower electrode of each capacitor is supported by a beam-like insulator at a side portion of the electrode, the side portion being apart from a lower edge of the lower electrode.
Claims5
A method of producing a semiconductor memory, comprising:
- forming an inter-layer insulating film over a semiconductor substrate, the inter-layer insulating film having at least one conductive plug embedded therein, the conductive plug being electrically connected to a diffusion layer formed in the surface of the semiconductor substrate;
- forming a first insulating film on the inter-layer insulating film;
- forming a first dummy insulating film on the first insulating film;
- forming a beam-like insulator on the first dummy insulating film;
- selectively removing the first dummy insulating film and the first insulating film to provide a hole, an outer wall portion of the hole touching the beam-like insulator and a bottom of the hole reaching the conductive plug;
- forming a first conductive film extending from an inner wall of the hole to the bottom thereof, the first conductive film functioning as a lower electrode;
- selectively removing the first dummy insulating film in relation to the beam-like insulator and the first insulating film to have the lower electrode, the beam-like insulator and the first insulating film remaining un-removed;
- forming a dielectric film to cover inner and outer surfaces of the lower electrode;
- and
- forming a second conductive film on the dielectric film, the second conductive film functioning as an upper electrode.
7 more elements
Dependencies are inferred from the claim text.