Multiple die stack apparatus employing T-shaped interposer elements
AssigneeMicron Technology, Inc.
InventorSalman Akram
Life of this patent
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Abstract
Multiple integrated circuit devices in a stacked configuration that use a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof are disclosed.
Claims48
A method of forming a stack of semiconductor devices on a substrate comprising:
- providing a first semiconductor device having at least one bond pad on an active surface thereof, mounted to the substrate;
- mounting a first interposer device to the first semiconductor device, on a side opposite the substrate, the first interposer device having a first surface of a first area and a second surface of a second area less than the first area with a first pair of recesses formed on opposing edges of the first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, the second surface mounted to the active surface of the first semiconductor device;
- and
- mounting a second semiconductor device to the first surface of the first interposer device, opposite the first semiconductor device.
A method for interposing a conductive apparatus between a first semiconductor device and a second semiconductor device, the method comprising:
- providing the first semiconductor device and the second semiconductor device each having a plurality of bond pads on an active surface thereof and a bottom surface;
- and
- providing an interposer comprising:
- a first surface having a first length and a first width;
- and
- a second surface having a length and a width smaller than the first width of the first surface, the first surface comprising an overhang portion of the conductive apparatus that protects the plurality of bond pads disposed on the first semiconductor device and the second surface being mountable to the active surface of the first semiconductor device.
A method of interposing a conductive apparatus between a plurality of semiconductor devices, comprising:
- providing a semiconductor device of a plurality of semiconductor devices having at least one
- bond pad on an active surface thereof and a bottom surface;
- and
- providing an interposer comprising:
- a first surface having a first length and a first width;
- a second surface having a length and a width smaller than the first width of the first surface, the first surface providing a protective overhang portion over the at least one bond pad on an active surface of a first semiconductor device of the plurality of semiconductor devices and the second surface being mountable to the active surface of the first semiconductor device.
A method of stacking semiconductor devices on a substrate comprising:
- providing a first semiconductor device having at least one bond pad on an active surface thereof, mounted to the substrate;
- mounting a thermally conductive first interposer device to the first semiconductor device, on a side opposite the substrate, the thermally conductive first interposer device having a first surface of a first area and a second surface of a second area less than the first area with a first pair of recesses formed on opposing edges of the thermally conductive first interposer device exposing the at least one bond pad on the active surface of the first semiconductor device, the second surface mounted to the active surface of the first semiconductor device;
- and
- a second semiconductor device, mounted to the first surface of the thermally conductive first interposer device, opposite the first semiconductor device.
A method for interposing an apparatus for between a first semiconductor device and a second semiconductor device, the first semiconductor device and the second semiconductor device each having a plurality of bond pads on the active surfaces thereof and a bottom surface, comprising:
- providing an interposer comprising:
- a first surface having a first length and a first width;
- and
- a second surface having a length and a width smaller than the first width of the first surface, the second surface providing a protective overhang portion of the apparatus protecting the plurality of bond pads disposed on the first semiconductor device and being mountable to the active surface of the first semiconductor device.
Dependencies are inferred from the claim text.