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US 7,064,004 B2Granted
Induction-based heating for chip attach
AssigneeIntel Corporation
InventorKristopher J. Frutschy
Life of this patent
Estimating the term…
Abstract
A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using induction heating to form the bond.
Claims49
A method of coupling a semiconductor die with a next level package, comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with an inductor;
- and
- exposing the semiconductor die to the electromagnetic flux to preferentially induce eddy currents in the semiconductor die to heat the semiconductor die and couple the semiconductor die with the next level package.
2 more elements
A method of coupling a semiconductor die with a next level package, comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with an inductor;
- and
- exposing the at least one interconnect to the electromagnetic flux to preferentially induce eddy currents in the at least one interconnect to heat the at least one interconnect and couple the semiconductor die with the next level package.
2 more elements
A method of coupling a semiconductor die with a next level package comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with a pancake coil;
- exposing the semiconductor die to the electromagnetic flux to preferentially induce eddy currents in the semiconductor die to heat the semiconductor die and couple the semiconductor die with the next level package.
1 more element
A method of coupling a semiconductor die with a next level package, comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with an inductor;
- scanning the inductor around the semiconductor die while generating an electromagnetic flux;
- exposing the semiconductor die to the electromagnetic flux to preferentially induce heating in the semiconductor die to heat the semiconductor die and couple the semiconductor die with the next level package.
2 more elements
A method of coupling a semiconductor die with a next level package comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with a pancake coil;
- exposing the at least one interconnect to the electromagnetic flux to preferentially induce heating in the at least one interconnect to heat the at least one interconnect and couple the semiconductor die with the next level package.
1 more element
A method of coupling a semiconductor die with a next level package, comprising:
- providing at least one interconnect;
- arranging the semiconductor die, the next level package, and the at least one interconnect such that the at least one interconnect is disposed so as to be capable of joining the semiconductor die to the next level package;
- generating an electromagnetic flux with an inductor;
- scanning the inductor around the at least one interconnect while generating an electromagnetic flux;
- exposing the at least one interconnect to the electromagnetic flux to preferentially induce heating in the at least one interconnect to heat the at least one interconnect and couple the semiconductor die with the next level package.
2 more elements
Dependencies are inferred from the claim text.