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US 7,064,003 B2Granted
Memory package
AssigneeSanDisk Corporation
InventorRobert F. Wallace
Life of this patent
Estimating the term…
Abstract
A memory chip package with a controller die on a first side of a printed circuit board and a memory die on a second side of the same printed circuit board. The memory chip package is integrated into a microprocessor controlled device or alternatively is integrated into a portable memory card.
Claims7
A method of making a memory package comprising:
- attaching a plurality of memory die to the first face of a circuit board;
- creating a plurality of recesses within a second face of the circuit board, each recess beneath the location of a memory die;
- attaching a plurality of controller die to the second face of the circuit board, each controller die positioned beneath a memory die and within a recess of the second face;
- forming vias in the circuit board connecting each memory die to a controller die beneath the memory die, to form a plurality of memory packages;
- and
- singulating the plurality of memory packages to form individual memory packages.
3 more elements
Dependencies are inferred from the claim text.