Backside failure analysis of integrated circuits
AssigneeIntersil Americas Inc.
InventorsWalter J. Rowe, Jr., Isaiah McDonald, Malcolm P. Cambra, Jr.
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Abstract
Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises removing a portion of the backside package of the DUT to allow for the implementation of an image based diagnostic test through the backside of the DUT. The functionality of DUT is destroyed by the removal of the portion of the backside package of the DUT. Further, restoring the functionality of the DUT with an interface carrier before an image based diagnostic test is conducted.
Claims18
A method of preparing a device under test (DUT) for an image based diagnostic test, the method comprising:
- removing a portion of the backside package of the DUT to allow for the implementation of a image based diagnostic test through the backside of the DUT, the electrical functionality of DUT being destroyed by the removal of the portion of the backside package of the DUT;
- and
- restoring the electrical functionality of the DUT with an interface carrier before an image based diagnostic test is conducted.
A method of testing a device under test (DUT), the method comprising:
- removing a portion of a backside of the DUT to expose a select signal layer the electrical functionality of the DUT being destroyed by the removal of the portion of the backside package of the DUT;
- coupling the DUT to an interface carrier;
- electrically coupling select device contacts of the exposed select signal layer of the DUT to select interface contacts of the interface carrier to restore electrical functionality of the DUT;
- and
- testing the DUT after the functionality of the DUT has been restored.
Dependencies are inferred from the claim text.