Method for realizing microchannels in an integrated structure
AssigneeSTMicroelectronics S.r.l.
InventorsAlessio M. D'arrigo Guiseppe, Rosario C. Spinella, Guiseppe Arena, Simona Lorenti
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Abstract
A process is presented for realizing buried microchannels (10) in an integrated structure (1) comprising a monocrystalline silicon substrate (2). The process forms in the substrate (2) at least one trench (4). A microchannel (10) is obtained starting from a small surface port of the trench (4) by anisotropic etching of the trench. The microchannel (10) is then completely buried in the substrate (2) by growing a microcrystalline structure to enclose the small surface port.
Claims35
A process for realizing fluid microchannels buried in an integrated structure comprising a monocrystalline silicon substrate, comprising:
- forming in said substrate at least a trench;
- and
- obtaining said fluid microchannels starting from a deep cavity characterized by a small surface port obtained through anisotropic etching of said at least one trench, said fluid microchannels being nearly entirely buried in said substrate in a completely monocrystalline structure which closes the surface port along a certain length of the fluid microchannel.
A method for forming fluid microchannels, comprising:
- forming a narrow elongated trench in a monocrystalline silicon substrate;
- performing an anisotropic wet etch of the narrow elongated trench to form a fluid microchannel structure having a generally rhombohedral cross-sectional shape with a top port substrate surface opening;
- and
- closing the top port substrate surface opening of the fluid microchannel structure along a certain length of elongated trench to entirely enclose the fluid microchannel structure.
A method for forming fluid microchannels, comprising:
- forming a monocrystalline silicon layer over a monocrytalline silicon substrate;
- forming a narrow elongated trench through the monocrystalline layer and into the monocrystalline silicon substrate;
- performing an etching of a base region of the narrow elongated trench to form a fluid microchannel structure having a top port opening;
- and
- closing the top port opening of the fluid microchannel structure along a certain length of the elongated trench to entirely enclose the fluid microchannel structure.
A process, comprising:
- forming an elongated trench in a monocrystalline silicon substrate;
- anisotropic etching of said elongated trench to obtain a deep cavity characterized by an elongated surface port;
- and
- closing at least a portion of the elongated surface port of the elongated trench to define with the deep cavity in the silicon substrate a tunnel-like microchannel.
Dependencies are inferred from the claim text.