Micromechanical component and method for producing the same
AssigneeRobert Bosch GmbH
InventorMarkus Lutz
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a micromechanical component has a substrate (1), a movable sensor structure (6) in a micromechanical functional layer (5) located over the substrate; a first sealing layer (8) on the first micromechanical functional layer (5) which is at least partly structured; a second micromechanical functional layer (10) on the first sealing layer (8), which has at least one sealing function and is anchored at least partly in the first micromechanical functional layer (5); and a second sealing layer (8) on the second micromechanical functional layer (10). The sensor structure (6) is provided with trenches (7) whose width is not larger than a maximum trench width (66), which is sealable by the first sealing layer (8) in the form of plugs (9) which do not extend to the trench bottoms.
Claims33
A method of manufacturing a micromechanical component, comprising:
- providing a substrate;
- providing a first micromechanical functional layer on the substrate;
- structuring the first micromechanical functional layer to include a sensor structure;
- providing a first sealing layer on the first micromechanical functional layer after the structuring of the first micromechanical functional layer, the first sealing layer having at least a covering function and being at least partially anchored in the first micromechanical functional layer;
- structuring the first sealing layer;
- providing a second micromechanical functional layer on the first sealing layer;
- structuring the second micromechanical functional layer;
- and
- making the sensor structure capable of vibrating;
- providing a second sealing layer on the second micromechanical functional layer;
- wherein a maximum trench width which is sealable by the first sealing layer in a form of a plurality of plugs is determined, the plurality of plugs not extending to a trench bottom;
- and
- wherein the sensor structure is provided with a plurality of trenches, a first width of the plurality of trenches being not larger than the maximum trench width.
A micromechanical component, comprising:
- a substrate;
- a movable sensor structure in a first micromechanical functional layer situated above the substrate;
- a first sealing layer on the first micromechanical functional layer, the first sealing layer being at least partially structured, the first sealing layer having at least one sealing function and being at least partially anchored in the first micromechanical functional layer;
- a second micromechanical functional layer on the first sealing layer;
- and
- a second sealing layer on the second micromechanical functional layer;
- wherein the movable sensor structure is provided with a plurality of trenches, a width of each trench being not larger than a maximum trench width, the plurality of trenches being sealable by the first sealing layer in a form of a first plurality of plugs, the first plurality of plugs not extending to a plurality of trench bottoms.
Dependencies are inferred from the claim text.