Adhesive sheet for affixation of a wafer and method for processing using the same

A method for processing a wafer by using an adhesive sheet including (i) a first substrate, (ii) a first adhesive layer arranged on the first substrate, (iii) a second substrate arranged on the first adhesive layer and (iv) a second adhesive layer arranged on the second substrate, wherein the first adhesive layer comprises a radiation-setting adhesive, and the second substrate comprises a heat-shrinkable plastic film, the method comprising:

• a first step of affixing the adhesive sheet to the wafer such that the second adhesive layer is disposed between the wafer and the second substrate;
• a second step of dicing the wafer into a plurality of chips, wherein the wafer is diced with the adhesive sheet affixed thereto, such that the second adhesive layer and the second substrate are diced together with the wafer without dicing the first substrate;
• a third step of peeling the first adhesive layer and the first substrate from the diced wafer by irradiating the first adhesive layer with radiation and, thereby, disjoining the plurality of chips from one another, wherein each of said disjoined plurality of chips has a portion of the second substrate affixed thereto by a portion of the second adhesive layer;
• and
• a fourth step of peeling the portion of the second adhesive layer and the portion of the second substrate from each of the plurality of chips by heat-shrinking the portion of the second substrate.

A method for processing a wafer by using an adhesive sheet including (i) a first substrate, (ii) a first adhesive layer arranged on the first substrate, (iii) a second substrate arranged on the first adhesive layer, and (iii) a second adhesive layer arranged on the second substrate, wherein the first substrate comprises a heat-shrinkable plastic film, and the second adhesive layer comprises a radiation-setting adhesive, the method comprising:

• a first step of affixing the adhesive sheet to the wafer such that the second adhesive layer is disposed between the wafer and the second substrate;
• a second step of dicing the wafer into a plurality of chips, wherein the wafer is diced with the adhesive sheet affixed thereto such that the second adhesive layer and the second substrate are diced together with the wafer without dicing the first substrate;
• a third step of peeling the first adhesive layer and the first substrate from the plurality of chips by heat-shrinking the first substrate and, thereby, disjoining the plurality of chips from one another, wherein each of said disjoined plurality of chips has a portion of the second substrate affixed thereto by a portion of the second adhesive layer;
• and
• a fourth step of peeling the portion of the second adhesive layer and the portion of the second substrate from each of the plurality of chips by irradiating the portion of the second adhesive layer with radiation.