Circuitized substrate and method of making same
AssigneeEndicott Interconnect Technologies, Inc.
InventorsElizabeth Foster, Gregory Kevern, Anita Sargent
Life of this patent
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Abstract
A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.
Claims12
A method of making a circuitized substrate, said method comprising:
- providing a polytetrafluoroethylene dielectric layer;
- immersing said polytetrafluoroethylene dielectric layer in a solution including a conductive monomer and a seed material for a predetermined time period;
- removing said polytetrafluoroethylene dielectric layer from said solution including said conductive monomer and said seed material and thereafter rinsing and drying said polytetrafluoroethylene dielectric layer;
- and
- thereafter electrolessly plating a plurality of copper circuit lines on said polytetrafluoroethylene dielectric layer, each of said copper circuit lines having a peel strength within the range of from about 2.3 to about 3.5 pounds per square inch.
A method of making a circuitized substrate, said method comprising:
- providing a polytetrafluoroethylene dielectric layer;
- immersing said polytetrafluoroethylene dielectric layer in a solution including a pyrrole conductive monomer and a palladium-tin seed material for a predetermined time period;
- removing said polytetrafluoroethylene dielectric layer from said solution including said pyrrole conductive monomer and said palladium-tin seed material and thereafter rinsing and drying said polytetrafluoroethylene dielectric layer;
- and
- thereafter electrolessly plating a plurality of copper circuit lines on said polytetrafluoroethylene dielectric layer, each of said copper circuit lines having a thickness of about 0.001 inch and a peel strength within the range of from about 2.3 to about 3.5 pounds per square inch.
Dependencies are inferred from the claim text.