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US 7,063,756 B2Granted
Enhanced design and process for a conductive adhesive
AssigneeInternational Business Machines Corporation
InventorsDonald Seton Farquhar, Gerald Paul Kohut, Andrew Michael Seman, Michael Joseph Klodowski
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Abstract
The present invention provides a new device and method for enhancing the electrical properties of the thick metal backer/electrically conductive thermoset adhesive/printed circuit board or card assembly. The enhanced electrical properties are obtained by providing a thin bondline of conductive adhesive that is essentially void free.
Claims17
A method for manufacturing an electrical component comprising:
- applying an electrically conductive thermoset adhesive paste onto essentially an entire bonding surface of a metal substrate;
- thereafter partially curing said adhesive;
- attaching a circuit board to said adhesive to form a substrate/adhesive/circuit board assembly;
- laminating said assembly in a lamination press to form an electrical component;
- and
- wherein said adhesive is about 20% to about 60% fully cured.
3 more elements
A method of manufacturing an electrical component comprising:
- applying an electrically conductive thermoset adhesive onto essentially an entire bonding surface of a metal substrate;
- thereafter partially curing said adhesive;
- attaching a circuit board to said adhesive to form a substrate/adhesive/circuit board assembly;
- laminating said assembly in a lamination press to form an electrical component;
- and
- wherein said partially cured adhesive has a viscosity of at least about 100 Pa-S to no more than about 1000 Pa-S.
3 more elements
Dependencies are inferred from the claim text.