Composite microelectronic spring structure and method for making same

A microelectronic contact structure, comprising:

• a column element comprising a top and a base, and wherein said base is positioned for attachment to a substrate;
• and
• a cantilevered, elongate beam, a first portion of said beam joined to said top of said column element, and a second portion of said beam disposed away from said column element and free to deflect independent of said first portion,
• wherein said column element comprises a wire.

A microelectronic contact structure, comprising:

• a plurality of substantially rigid column elements, each of said plurality of column elements comprising:
• a core element attached at a first end to a terminal of an electronic component, and
• an over coat covering at least a portion of said core element, wherein said core element comprises a first material and said over coat comprises a second material, and said first material is one of softer, less rigid, or has a lower modulus of elasticity than said second material;
• and
• a contact element joined to a second end of said plurality of column elements,
• further comprising a substrate joined to each of said column elements at said base thereof, and wherein said contact element comprises a beam and said beam has a free end cantilevered from said column elements,
• wherein said microelectronic spring structure is configured such that said top of each of said column elements is substantially fixed while said free end of said beam will deflect under a force applied to said beam at said free end in a direction transverse to said substrate, and
• each of said column elements is connected at said base thereof to a terminal of said substrate, and further comprising a connector comprising a wire core joined to said terminal of said substrate, and connected to a second terminal of said substrate.

A substrate-mounted microelectronic spring structure, comprising:

• a substrate;
• a substantially rigid column element having a top and a base, and joined at said base to said substrate, wherein said column element comprises a substantially straight segment of wire;
• and
• a resilient cantilevered beam having a free end, and joined to said top of said column element at a joint a distance away from said free end;
• wherein said microelectronic spring structure is configured such that said top of said column element is substantially fixed while said cantilever beam permits elastic deflection of said free end thereof under a force applied to said beam at said free end towards said substrate.

A microelectronic spring structure, comprising:

• substrate means for supporting a structure:
• support means for supporting a beam, for securing a beam to said substrate means, and for elevating a beam above said substrate means, wherein said support means comprises at least one substantially rigid column element having an at least partially over coated core element, wherein said core element comprises a first material and said over coat comprises a second material, and said first material is one of softer, less rigid, or has a lower modulus of elasticity than said second material;
• and
• resilient beam means for contacting an electronic component, said resilient beam means supported by said support means,
• wherein said core element of said at least one column element comprises a segment of wire.