Optical module and method of manufacturing the same, and hybrid integrated circuit, hybrid circuit board, electronic apparatus, opto-electricity mixed device, and method of manufacturing the same

A method of manufacturing an optical module including a transparent substrate having an electro optical element on one surface side and an optical transmission line support member, which is arranged on the other surface side of the transparent substrate and supports one end of an optical transmission line, the method of manufacturing the optical module comprising the steps of:

• forming a guide hole in either the transparent substrate or the optical transmission line support member;
• forming a fitting hole, into which the guide pin is to be fitted, in the other one of the transparent substrate and the optical transmission line support member, in which the guide hole is not formed, such that the diameter of the fitting hole is made larger as compared with the diameter of the guide pin;
• inserting a part of the guide pin into the fitting hole;
• filling up a gap between the guide pin and the fitting hole with a filler material, which is cured by carrying out a predetermined processing;
• adjusting a position of the guide pin within a range in which the guide pin is movable inside the fitting hole;
• and
• curing the filler material by carrying out the predetermined processing to the filler material, which is filled up in the gap between the guide pin and the fitting hole.

A method of manufacturing an optical module including a transparent substrate having an electro optical element on one surface side and an optical transmission line support member, which is arranged on the other surface side of the transparent substrate and supports one end of an optical transmission line, the method of manufacturing the optical module comprising the steps of:

• forming a guide pin in either the transparent substrate or the optical transmission line support member;
• forming a guide hole, in which the guide pin is to be inserted, in the other one of the transparent substrate and the optical transmission line support member, in which the guide pin is not formed, such that the diameter of the guide hole is made larger to produce a gap between the guide pin and the guide hole when the guide pin is inserted into the guide hole;
• mounting the optical transmission line support member on the transparent substrate such that the guide pin is being inserted into the guide hole;
• filling up the gap between the guide pin and the guide hole with a filler material, which is cured by carrying out a predetermined processing;
• adjusting a position of the optical transmission line support member within a range in which the guide pin is movable inside the guide hole;
• and
• curing the filler material by carrying out the predetermined processing to the filler material, which is filled up in the gap between the guide pin and the guide hole.

A method of manufacturing an optical module including a transparent substrate having an electro optical element on one surface side, an optical transmission line support member, which is arranged on the other surface side of the transparent substrate and supports one end of an optical transmission line, and an optical coupling member, which is arranged on the other side surface of the transparent substrate and has a role of optical coupling the electro optical element with the optical transmission line, wherein the method of manufacturing the optical module comprising the steps of:

• forming a guide pin in either the optical transmission line support member or the optical coupling member;
• forming a guide hole, in which the guide pin is to be inserted, in the other one of the optical transmission line support member and the optical coupling member, in which the guide pin is not formed, such that the diameter of the guide hole is made larger to produce a gap between the guide pin and the guide hole when the guide pin is inserted into the guide hole;
• mounting the optical transmission line support member on the transparent substrate such that the guide pin is being inserted into the guide hole;
• filling up the gap between the guide pin and the guide hole with a filler material, which is cured by carrying out a predetermined processing;
• adjusting a position of the optical transmission line support member within a range in which the guide pin is movable inside the guide hole;
• and
• curing the filler material by carrying out the predetermined processing to the filler material, which is filled up in the gap between the guide pin and the guide hole.

An optical module, comprising:

• a transparent substrate, which has optical permeability to the wavelength of the light used;
• an electro optical element, which is arranged on one surface side of the transparent substrate and radiates signal light toward the other surface side of the transparent substrate according to provided electrical signal, or which generates electrical signal according to the luminous intensity of signal light provided from the other surface side of the transparent substrate;
• an optical transmission line support member, which is arranged on the other surface side of the transparent substrate and supports one end of an optical transmission line;
• and
• an optical coupling member, which is arranged on the other surface side of the transparent substrate and performs optical coupling between the electro optical element and the optical transmission line, wherein either the transparent substrate or the optical transmission line support member has a guide pin, while the other one has a guide hole, in which the guide pin is to be inserted, and the diameter of the guide hole is made larger as compared with the diameter of the guide pin so that a gap is produced between the guide pin and the guide hole, and the gap between the guide pin and the guide hole is filled up with a predetermined filler material.

An optical module, comprising:

• a transparent substrate which has optical permeability to the wavelength of the light used;
• an electro optical element, which is arranged on one surface side of the transparent substrate and radiates signal light toward the other surface side of the transparent substrate according to provided electrical signal, or which generates electrical signal according to the luminous intensity of signal light provided from the other surface side of the transparent substrate;
• an optical transmission line support member, which is arranged on the other surface side of the transparent substrate and supports one end of an optical transmission line;
• and
• an optical coupling member, which is arranged on the other surface side of the transparent substrate and performs optical coupling between the electro optical element and the optical transmission line, wherein either the optical transmission line support member or the optical coupling member has a guide pin and the other one has a guide hole, in which the guide pin is to be inserted, and the diameter of the guide hole is made larger as compared with the diameter of the guide pin so that a gap is produced between the guide pin and the guide hole, and the gap between the guide pin and the guide hole is filled up with a predetermined filler material.

A method of manufacturing an opto-electricity mixed device,including:

• a circuit board, having a conductive film transmitting electrical signal and an optical transmission line having a roll of transmitting signal light;
• and
• a hybrid integrated circuit chip, which is coupled to the circuit board and has a role of conversion between the electrical signal and the signal light, wherein the method of manufacturing the opto-electricity mixed device comprising the steps of:
• forming a guide pin in either the hybrid integrated circuit chip or the circuit board;
• forming a guide hole in the other one of the hybrid integrated circuit chip and the circuit board, in which the guide pin is to be inserted, such that the diameter of the guide hole is made larger as compared with the diameter of the guide pin;
• arranging a jig having a protruding portion on top of the circuit board, which diameter is substantially the same as the diameter of the guide pin, such that the protruding portion is being inserted into the guide hole;
• filling up the gap between the protruding portion and the guide hole with a filler material, which is cured by carrying out a predetermined processing;
• adjusting a position of the jig within a range in which the protruding portion is movable inside the guide hole;
• curing the filler material by carrying out the predetermined processing to the filler material, which is filled up in the gap between the protruding portion and the guide hole;
• and
• pulling out the protruding portion from the guide hole after having cured the filler material.

A method of manufacturing an opto-electricity mixed device, including a circuit board having a conductive film transmitting electrical signal and an optical transmission line transmitting signal light, and a hybrid integrated circuit chip, which is coupled to the circuit board and converts the electrical signal into signal light, vice versa, the method of manufacturing the opto-electricity mixed device comprising the steps of:

• forming a guide pin in either the hybrid integrated circuit chip or the circuit board;
• forming a guide hole, in which the guide pin is to be inserted, in the other one of the hybrid integrated circuit chip and the circuit board, and which diameter is made larger so that a gap is produced between the guide pin and the guide hole when the guide pin is inserted into the guide hole;
• mounting the hybrid integrated circuit chip on top of the circuit board such that the guide pin is being inserted into the guide hole;
• filling up the gap between the guide pin and the guide hole with a filler material, which is cured by carrying out a predetermined processing;
• adjusting a position of the hybrid integrated circuit chip within a range in which the guide pin is movable inside the guide hole;
• and
• curing the filler material by carrying out the predetermined processing to the filler material, which is filled up in the gap between the guide pin and the guide hole.