Electrical circuit apparatus and method

A method for assembling an electrical circuit apparatus comprising a substrate having a ground layer, at least one device aperture, and at least one solder aperture, a heat sink, and an adhesive layer having at least one device aperture and at least one solder aperture, said method comprising the steps of:

• a) aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate device aperture with the at least one adhesive layer device aperture;
• b) mechanically coupling said heat sink to the ground layer of said substrate using said adhesive layer such that at least a portion of the substrate device aperture overlaps said heat sink;
• c) filling at least a portion of said at least one adhesive layer solder aperture and at least a portion of said adhesive layer device aperture with solder;
• and
• d) performing a process for solder wetting, wherein the aligning of the at least one substrate solder aperture with the at least one adhesive layer solder aperture and the aligning of the at least one substrate device aperture with the at least one adhesive layer device aperture causes said solder to flow from said solder apertures to a predetermined area between said heat sink and the ground layer of said substrate.