Loading patent…
AssigneeIndustrial Technology Research Institute
InventorsKuei-Jung Chen, Chin-Chong Chiang
Estimating the term…
A brittle material rotating and aligning mechanism including a bearing, a rotary table, and a driving mechanismU, and installed in the worktable of a brittle material scribing and breaking apparatus; carries brittle material, for example, a semiconductor wafer for scribing and breaking into individual dies. The driving mechanism uses a flexible transmission member to rotate the rotary table for low installation cost, no requirement for a precision adjustment during installation, and, preventing the occurrence of back lash or the production of particles due to friction between the transmission member and the driving wheel of the driving mechanism, or between the transmission member and the rotary table.
A brittle material rotating and aligning mechanism, comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Apparatus for manufacture or treatment: apparatus for mechanical treatment or grinding or cutting
By breaking, e.g. dicing: with preliminary treatment, e.g. weakening by scoring
For supporting, holding, feeding, conveying or discharging work: the supporting or holding device being angularly adjustable
Handling or holding of wafers, substrates or devices during manufacture or treatment thereof: for positioning, orientation or alignment
Term ended 5 Feb 2023 (estimated)
1. Field of the Invention
The present invention relates to a brittle material rotating and aligning mechanism and more particularly to such a brittle material rotating and aligning mechanism, which is practical for use in a brittle material scribing and breaking apparatus to carry the workpiece for scribing and breaking into individual pieces.
2. Description of Related Art
FIG. 1 illustrates a brittle material rotating and aligning mechanism installed in a wafer scribing and breaking apparatus according to the present invention.
FIG. 2 is an exploded view of the brittle material rotating and aligning mechanism according to the present invention.
FIG. 3 is a section view of the rotary table and the bearing according to the present invention.
With reference to FIG. 1, a brittle material rotating and aligning mechanism is shown installed in a wafer scribing and breaking apparatus 8.
With reference to FIG. 2, the aforesaid brittle material rotating and aligning mechanism is comprised of a bearing 2, a rotary table 3, and a driving mechanism 4.
Referring to FIG. 3 and FIGS. 1 and 2 again, the bearing 2 comprises a first annular bearing element 21 fixedly fastened to the top of the worktable 1 of a wafer scribing and breaking apparatus 8 by screws (not shown), the first annular bearing element 21 having a flange 211 extended along the inner diameter, a second annular bearing element 22 coaxially mounted on the first annular bearing element 21, a supplementary annular bearing element 221 fixedly fastened to the bottom side of the second annular bearing element 22 by screws (not shown) and defining with the second annular bearing element 22 an endless groove 222, which receives and supports the flange 211 of the first annular bearing element 21, for enabling the second annular bearing element 22 and the supplementary annular bearing element 221 to be rotated relative to the first annular bearing element 21. In order to smoothen the rotary motion of the second annular bearing element 22 and the supplementary annular bearing element 221 relative to the first annular bearing element 21, a lubricating layer 23 is formed in between the endless groove 222 and the flange 211. According to this embodiment, the bearing 2 is a sliding bearing. Alternatively, a ball bearing, needle bearing, or any suitable equivalent bearing may be used.