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US 7,062,849 B2Granted
Method for producing circuitry using molten metal droplets
AssigneeYazaki Corporation
InventorsHitoshi Ohashi, Hitoshi Ushijima, Kinya Horibe
Life of this patent
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Abstract
A method for producing a circuitry includes steps of providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit, and jetting droplets of molten metal on a substrate so as to form the first circuit based on the coordinate data.
Claims5
A method for producing a circuitry, comprising the steps of:
- providing first coordinate data of at least one of positions, shapes and intervals of patterns of a first circuit;
- and
- jetting droplets of molten metal on a substrate so as to form the first circuit based on the coordinate data and
- further comprising the steps of:
- jetting the droplets of the molten metal on the first circuit so as to form a joint portion:
- forming an insulation layer on the first circuit so that the joint portion is surrounded with the insulation layer;
- providing second coordinate data of at least one of positions, shapes and intervals of patterns of a second circuit;
- and
- jetting the droplets of the molten metal on the insulation layer so as to form the second circuit so that the first circuit and the second circuit are electrically connected via the joint portion based on the second coordinate data.
6 more elements
Dependencies are inferred from the claim text.