Method of forming an embedded read element

A method of forming an embedded read element, comprising:

• performing a photolithographic patterning step for defining a designed height of an embedded read element on a wafer, wherein the definition of the height of the embedded read element also results in formation of an in-line lapping guide with a spacing formed between the embedded read element and the in-line lapping guide;
• performing a further photolithographic patterning step for defining a designed width of the embedded read element;
• performing a further photolithographic patterning step for connecting the embedded read element and the in-line lapping guide with conducting layers;
• performing a first mechanical lapping step on the wafer, wherein the first mechanical lapping step is monitored by measuring the resistance of a parallel circuit of the embedded read element and the in-line lapping guide;
• and
• performing a second mechanical lapping step on the wafer, wherein the second mechanical lapping step is monitored by measuring the GMR response of the embedded read element.