US 7,061,083 B1Granted

Semiconductor devices

AssigneeHitachi, Ltd.

InventorsMitsuo Usami, Kazutaka Tsuji, Takeshi Saito, Akira Sato, Kenji Sameshima, Kazuo Takaragi, Chizuko Yasunobu

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Abstract

This Application is intended to provide a method for effectively protecting paper or film-form media against forgery. This can be achieved by, for example, embedding in a paper or film-form medium a thin semiconductor chip up to 0.5 mm square, equipped with an antenna, and characterized in that the side walls of the semiconductor chip are formed using oxide films, and in that multiple such semiconductor chips are separated by etching. Limiting the size of these semiconductor chips to 0.5 mm or less enables improvement against bending and concentrated loads, and separating the semiconductor chips by etching results in semiconductor chips free from cracking and breakage. Also, the oxide films constituting the side walls of the semiconductor chips prevents short-circuiting at edges during connection to the respective antennas. Thus, simplified processes can be adopted.

Claims2

Dependent claims

A non-contact identification semiconductor device comprising:

a bendable paper or bendable film-form medium;
a semiconductor chip inserted into said bendable paper or bendable film-form medium, said semiconductor chip including means for receiving an inquiry to the non-contact identification semiconductor device, a memory for storing identification information of multiple bits and means for sending and said identification information of multiple bits;
an antenna coupled to said semiconductor chip to receive said identification information of multiple bits from said semiconductor chip and to transmit said identification information outside of said non-contact identification semiconductor device;
and
means for reducing stress concentration on said semiconductor chip during bending of said bendable paper or bendable film-form medium, wherein said means for reducing stress concentration comprises forming said semiconductor chip to have a long side length not greater than 0.5 mm in plane dimension.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 09/868,231Filed 10 Dec 1999
Priority: JP 10-35867417 Dec 1998
Granted: 13 Jun 2006
Term ends: Not estimatedThe source records don’t support an estimate.

Classification43 codes

B42D 25/30
Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof: identification or…
D21H 21/48
Latent security elements, i.e. detectable or becoming apparent only by use of special verification or tampering devices or methods: elements…
G06K 7/0008
Methods or arrangements for sensing record carriers, e.g. for reading patterns: general problems related to the reading of electronic memory…
G06K 19/073
With integrated circuit chips: special arrangements for circuits, e.g. for protecting identification code in memory