Display device and method of manufacturing the same
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Setsuo Nakajima
Life of this patent
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Abstract
To provide a technique for manufacturing a high-performance display device by employing a plastic substrate. A peeling layer is formed on an element-forming substrate, and a semiconductor element and a luminous element are further formed thereon. Then, a fixed substrate (130) is bonded on the luminous element by using a first adhesive (129). The entire substrate in this state is exposed in a gas containing halogen fluoride to thereby remove the peeling layer and separate the element-forming substrate. Thereafter, a bonding substrate (132) that comprises a plastic substrate is bonded in place of the separated element-forming substrate.
Claims29
A method of manufacturing a display device, comprising:
- forming a peeling layer on a first substrate;
- forming an insulating layer on said peeling layer;
- forming a light emitting element on said insulating layer;
- bonding a second substrate over said light emitting element by using a first adhesive;
- exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and the first substrate;
- and
- bonding a third substrate to said insulating layer by using a second adhesive.
A method of manufacturing a display device, comprising:
- forming a peeling layer on a first substrate;
- forming an insulating layer on said peeling layer;
- forming a semiconductor element on said insulating layer;
- forming at least one interlayer insulating film over the semiconductor element;
- forming a light emitting element over the interlayer insulating film, the light emitting element electrically connected to said semiconductor element;
- bonding a second substrate over said light emitting element by using a first adhesive;
- exposing the peeling layer to a gas containing halogen fluoride after bonding said second substrate to thereby remove said peeling layer and first substrate;
- and
- bonding a third substrate to said insulating layer by using a second adhesive.
A method of manufacturing a display device, comprising:
- forming a peeling layer on a first substrate;
- forming an insulating layer on the peeling layer;
- forming a switching element on the insulating layer;
- forming at least one interlayer insulating film over the switching element;
- forming a display element over the interlayer insulating film, the display element electrically connected to the switching element;
- bonding a second substrate over the display element by using a first adhesive;
- exposing the peeling layer to a gas containing halogen fluoride after bonding the second substrate to thereby remove the peeling layer and the first substrate;
- and
- bonding a third substrate to the insulating layer by using a second adhesive.
A method of manufacturing a display device comprising:
- forming a peeling layer on a first substrate;
- forming an insulating layer on the peeling layer;
- forming active layers, a gate insulating layer, and gate electrodes over the insulating layer;
- forming a first interlayer insulating layer to cover the gate electrodes;
- forming wirings and pixel electrodes over the first interlayer insulating layer, the wirings and the pixel electrodes electrically connected with the active layers, respectively;
- exposing the peeling layer to a gas containing halogen fluoride to thereby remove the peeling layer;
- forming a light emitting layer and a cathode on at least one of the pixel electrodes;
- bonding a second substrate on the cathode by using a first adhesive;
- removing the first substrate after bonding the second substrate;
- and
- bonding a third substrate to the insulating layer by using a second adhesive.
Dependencies are inferred from the claim text.