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US 7,058,474 B2Granted
Multi-layer printed circuit board fabrication system and method
AssigneeOrbotech Ltd.
InventorsAmnon Ganot, Hanan Gino, Golan Hanina, Zeev Kantor, Boris Kling, Shabtay Spinzi, Barry Ben-Ezra
Life of this patent
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Abstract
A method for aligning an image to be recorded by a direct image scanner on an upper layer of a printed circuit board with an image recorded on a lower layer thereof, the method comprising: visually imaging a portion of the image on the lower layer; and recording a pattern on the upper layer, referenced to coordinates of the visual image of the portion.
Claims1
A method of image alignment, comprising:
- producing an array of elements on a multi-layered substrate comprising at least two layers adhered together, said array being defined by vias passing through at least a first layer and not passing through a second layer of said multi-layered substrate;
- and
- matching said pattern with an identical pattern, such that said image is aligned with a portion of an electrical circuit already formed on a layer of said multi-layered substrate, when the patterns overlay each other.
Dependencies are inferred from the claim text.