Semiconductor substrate having increased fracture strength
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid O. Ramos, Martin Bresciani
Life of this patent
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Abstract
A semiconductor substrate includes electronic circuitry and has a machined feature formed therein. The semiconductor substrate is formed by a process which includes providing the semiconductor substrate having the electronic circuitry formed therein, and performing a machining process on the substrate to form the machined feature therein. The machined feature includes a slot and the machining process forms cracks at ends of the slot that reduce a fracture strength of the substrate. Removing portions of the semiconductor substrate proximate the cracks such that end points of the cracks have a curved terminus as formed by the removed portions improves the fracture strength of the substrate.
Claims10
A printhead comprising a semiconductor substrate including electronic circuitry and having a machined feature formed therein, said semiconductor substrate being formed by the following process:
- providing the semiconductor substrate having the electronic circuitry formed therein;
- performing a machining process on said substrate to form said machined feature therein, said machined feature including a slot and the machining process forming cracks at ends of the slot that reduce a fracture strength of the substrate;
- and
- removing portions of said semiconductor substrate proximate said cracks so as to improve the fracture strength of the substrate, wherein end points of the cracks have a curved terminus as formed by the removed portions,
- the printhead further comprising a barrier layer disposed between an orifice layer and the semiconductor substrate.
Dependencies are inferred from the claim text.