Apparatuses and method for maskless mesoscale material deposition
AssigneeOptomec Design Company
InventorsMichael J. Renn, Bruce H. King, Marcelino Essien, Lemna J. Hunter
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AssigneeOptomec Design Company
InventorsMichael J. Renn, Bruce H. King, Marcelino Essien, Lemna J. Hunter
Estimating the term…
Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible.
An apparatus for maskless mesoscale material deposition of liquids or liquid particle suspensions in patterns on a target, said apparatus comprising:
Dependencies are inferred from the claim text.