Mold component and mold assembly
AssigneeTDK Corporation
InventorsAtsushi Koyama, Mamoru Usami, Kenji Yamaga, Mikio Domon, Kazuki Suzawa
Life of this patent
Estimating the term…
Loading patent…
AssigneeTDK Corporation
InventorsAtsushi Koyama, Mamoru Usami, Kenji Yamaga, Mikio Domon, Kazuki Suzawa
Estimating the term…
There is provided a mold component which makes it possible to mold a substrate for an optical recording medium which enables a functional layer having a uniform thickness to be formed thereon without using a resin-coating assisting member. A stamper holder holds a stamper thereon, and has a generally hollow cylindrical shape. An insertion hole formed through a central portion of the stamper has a diameter which is larger than an outer diameter of a cavity-side end of the stamper holder at a higher temperature of the holder than a normal temperature, and is slightly smaller than the outer diameter at the normal temperature of the holder. The cavity-side end inserted into the insertion hole at the higher temperature of the stamper is grasped by a rim of the insertion hole which is reduced in diameter at the normal temperature of the stamper.
A mold component of a mold assembly that includes a first mold and a second mold which close to thereby define a cavity therebetween for molding a substrate for an optical recording medium, the mold component being mounted to a mounting portion of the first mold of the mold assembly, and comprising:
A mold assembly for defining a cavity for molding a substrate for an optical recording medium, comprising:
A mold assembly, comprising:
Dependencies are inferred from the claim text.