Mold material processing device, method and apparatus for producing same

A method for producing a molten material processing device comprising the steps of:

• providing a molten material processing device body having a recess in a surface thereof and providing an elongated thermal element, wherein the recess has a cross-section that is larger than a cross-section of the thermal element, and the recess includes a first portion and a second portion;
• pressing the thermal element into the second portion such that a space is created within the recess between the thermal element and the processing device body;
• and
• thermal spraying a material into the space such that the thermal element is embedded in the processing device.

An apparatus for producing a molten material processing device, comprising:

• thermal spraying equipment;
• a supporting device for supporting a molten material processing device body;
• a pressing device for pressing a thermal element into a recess in a surface of the processing device body;
• and
• a control device, wherein the thermal spraying equipment and the supporting device are movably arranged and controlled by the control device to cooperate with each other such that a thermally-sprayed material is sprayed into the recess, thereby embedding the thermal element after the thermal element is pressed into the recess by the pressing device.

A molten material processing device, comprising:

• a molten material processing device body;
• a thermal element recess including at least one second recess formed in a wall of the thermal element recess, the thermal element recess being located in a surface of the processing device body;
• and
• at least one elongated thermal element located in the thermal element recess,
• wherein the thermal element recess has a depth which is larger than a width of the thermal element so that a space is created within the thermal element recess between the thermal element and the surface of the processing device body,
• wherein a lower portion of the thermal element recess is adapted to partially surround and directly contact the thermal element, and
• wherein the second recess is located adjacent to the thermal element and is configured such that a wall of the second recess acts as a spring when the thermal element is pressed into the thermal element recess.