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US 7,044,143 B2Granted
Detergent injection systems and methods for carbon dioxide microelectronic substrate processing systems
AssigneeMicell Technologies, Inc.
InventorsJames P. DeYoung, James B. McClain, Stephen M. Gross
Life of this patent
Estimating the term…
Abstract
Microelectronic substrate processing systems include a microelectronic substrate processing chamber that is configured to contain therein at least one microelectronic substrate. A carbon dioxide supply system is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber. A detergent supply system is configured to supply detergent to the microelectronic substrate processing chamber.
Claims17
A microelectronic substrate processing method comprising:
- providing microelectronic substrate processing chamber that is configured to perform a microelectronic fabrication process on at least one microelectronic substrate that is contained therein;
- supplying densified carbon dioxide to the microelectronic substrate processing chamber from a carbon dioxide supply system, the densified carbon dioxide being used to perform the microelectronic fabrication process on the microelectronic substrate that is contained in the microelectronic substrate processing chamber;
- and
- supplying detergent to the microelectronic substrate processing chamber from a detergent supply system, the detergent being used to perform the microelectronic fabrication process on the microelectronic substrate that is contained in the microelectronic substrate processing chamber;
- and
- providing an auxiliary vessel that is separate from the microelectronic substrate processing chamber;
- wherein supplying detergent comprises:
- reducing pressure in said microelectronic substrate processing chamber and said auxiliary vessel;
- then
- adding a detergent formulation to said auxiliary vessel;
- then
- increasing the pressure in said microelectronic substrate processing chamber so that densified carbon dioxide can be pumped therethrough to clean the at least one microelectronic substrate in said microelectronic substrate processing chamber;
- and then
- transferring said detergent formulation from said auxiliary vessel to said microelectronic substrate processing chamber to facilitate the cleaning of the at least one microelectronic substrate therein.
11 more elements
A microelectronic substrate processing system comprising:
- a microelectronic substrate processing chamber that is configured to perform a microelectronic fabrication process on at least one microelectronic substrate that is contained therein;
- a carbon dioxide supply system that is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber that is used in performing the microelectronic fabrication process on the microelectronic substrate that is contained therein;
- and
- a detergent supply system that is configured to supply detergent to the microelectronic substrate processing chamber that is used in performing the microelectronic fabrication process on the microelectronic substrate that is contained therein;
- wherein the microelectronic substrate processing chamber includes a first supply line and a second supply line, wherein the carbon dioxide supply system is configured to supply densified carbon dioxide to the microelectronic substrate processing chamber via the first supply line and wherein the detergent supply system is configured to supply detergent to the microelectronic substrate processing chamber via the second supply line;
- wherein the detergent supply system comprises:
- an auxiliary vessel that is connected to the microelectronic substrate processing chamber by the second supply line;
- a vent line connecting The auxiliary vessel to the microelectronic substrate processing chamber;
- a detergent reservoir;
- a detergent supply line connecting the detergent reservoir to the auxiliary vessel;
- and
- a drain control system operatively associated with the second supply line and configured to control a time of draining of detergent formulation from the auxiliary vessel into the microelectronic substrate processing chamber.
9 more elements
Dependencies are inferred from the claim text.