Heating system
AssigneeKoninklijke Philips Electronics N. V.
InventorRene Henk Van Der Woude
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Abstract
A heating system employs a ceramic substrate and a resistive layer. The resistive layer includes a thermally stable resin, which is filled with a conductive material. A method of manufacturing such a heating system involves a provision of a ceramic substrate and an application of a resistive layer on the substrate. In the method, the resistive layer comprises includes a thermally stable resin, which is filled with a conductive material. Before application of the resistive layer, an adhesion promotor is applied on the ceramic substrate.
Claims18
A heating system, comprising:
- a ceramic substrate;
- an adhesive promotor applied to the ceramic substrate;
- and
- a resistive layer applied to the adhesive promotor to thereby bond the resistive layer to the ceramic substrate,
- wherein the resistive layer includes a thermally stable resin filled with a conductive material;
- and
- the ceramic substrate includes a substrate of steel that is provided with an enamel layer.
A method of manufacturing a heating system, the method comprising:
- providing a ceramic substrate, the substrate comprising an enamel layer on a substrate of steel;
- applying an adhesive promotor on the enamel layer of the ceramic substrate;
- and
- applying a resistive layer on the adhesive promotor to thereby bond the resistive layer to the ceramic substrate,
- wherein the resistive layer includes a polyimide filled with a conductive material.
A heating system, comprising:
- a ceramic substrate with an enamel layer on a substrate of steel;
- an adhesive promotor applied to the enamel layer;
- and
- a resistive layer applied to the adhesive promotor to thereby bond the resistive layer to the ceramic substrate,
- wherein the resistive layer includes a thermally stable resin filled with a conductive material.
Dependencies are inferred from the claim text.