Method for polishing a substrate surface
AssigneesRensselaer Polytechnic Institute, Crystal IS, Inc.
InventorsLeo J. Schowalter, Javier Martinez Lopez, Juan Carlos Rojo, Kenneth Morgan
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Abstract
According to one aspect of the invention, an improved process for preparing a surface of substrate is provided wherein the surface of the substrate is prepared for a chemical mechanical polishing (CMP) process, the CMP process is performed on the surface of the substrate, and the surface of the substrate is finished to clear the substrate surface of any active ingredients from the CMP process. Also, an improved substrate produced by the method is provided. According to one aspect of the invention, particular polishing materials and procedures may be used that allow for increased quality of AlN substrate surfaces.
Claims15
A method of preparing a surface of an aluminum nitride (AlN) substrate, the method comprising the acts of:
- preparing the surface of the AlN substrate for a chemical mechanical polishing (CMP) process;
- performing the CMP process on the surface of the AlN substrate;
- and
- finishing the surface of the AlN substrate, wherein the act of performing the CMP process further comprises an act of applying an abrasive suspension in a solution during the CMP process at a rate of approximately 0.5 mL per minute for a circular 8.0″ diameter polishing surface.
A method of preparing a surface of an aluminum nitride (AlN) substrate, the substrate being a substantially on-axis, Al-polarity, c-face surface, the method comprising the acts of:
- preparing the surface of the AIN substrate for a chemical mechanical polising (CMP) process;
- performing the CMP process on the surface of the AlN substrate;
- and
- finishing the surface of the AIN substrate wherein the act of performing the CMP process further comprises an act of applying an abrasive suspension in a solution during the CMP process the abrasive suspension having a pH value of approximately 10.5 or greater.
A method for preparing a surface of an aluminum nitride (AIN) substrate, the method comprising acts of:
- preparing the surface of the AlN substrate for a chemical mechanical polishing (CMP) process, the act of preparing comprising acts of:
- determining an orientation of the AlN substrate;
- and
- performing a removal of the surface of the AlN substrate based on the orientation.
Dependencies are inferred from the claim text.