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US 7,033,068 B2Granted
Substrate processing apparatus for processing substrates using dense phase gas and sonic waves
AssigneesRecif, Societe Anonyme, Techsonic
InventorsGil Ching, Vincent Perrut, Vincent Ruch, Gilles Fresquet
Life of this patent
Estimating the term…
Abstract
Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.
Claims9
A substrate processing apparatus comprising:
- a) a processing chamber;
- b) a substrate holder inside of the processing chamber for holding a substrate;
- c) a sonic box facing the substrate holder and located in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate, the sonic box comprising i) a membrane, and ii) a transducer coupled to the membrane, iii) a body having an open region, wherein the membrane covers the open region and forms an enclosure with the body;
- and iv) an incompressible liquid in the enclosure.
1 more element
Dependencies are inferred from the claim text.